Tech Xplore on MSN

AI memory bottleneck may ease as ultrathin chip stacks quadruple high-bandwidth memory density

A Korean research team has developed a technology that enables the stable stacking of more than 10 ultrathin semiconductor ...
Electronic Design

AMD Moves from HBM to LPDDR5X with New Memory-on-Package SoC

The company is replacing hard-to-find high bandwidth memory (HBM) with LPDDR5X in its latest Versal processor.
Tom's Hardware on MSN

Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer

The patent was filed 18 months ago, and there's no further indication of ongoing development ...
EDN

CXL Type 3: Tooling and boot path from power-on to usable memory

Part 1 of this min-series established why CXL Type 3 memory expanders matter for capacity-bound workloads and where expander ...
IEEE Spectrum on MSN

Stacking chips sideways gives AI more memory

Solving a tricky 3D integration problem could boost bandwidth and keep chips cooler ...